Packaging process and manufacturing method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih
Life of this patent
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Abstract
A manufacturing method and a packaging process are provided. A package having a first die and a second die is provided. A circuit substrate having a first warpage level is provided. The package is mounted onto the circuit substrate and then heated under an elevated temperature to bond the package to the circuit substrate. The package heated under the elevated temperature is warped with a second warpage level, and the first warpage level is substantially in conformity with the second warpage level.
Claims20
A bonding process, comprising:
- providing a circuit substrate on a fixture, wherein the circuit substrate has a mounting surface and mounting portions formed on the mounting surface;
- performing a substrate padding process;
- mounting a package onto the mounting surface of the circuit substrate, wherein the package has a bottom surface and connectors formed on the bottom surface of the package;
- and
- performing a reflow process and bonding the connectors of the package to the mounting portions of the circuit substrate.
A packaging process, comprising:
- providing a package having a first die and a second die, wherein the first and second dies are different types of dies;
- performing a warpage assessing process;
- providing a circuit substrate having a first warpage level;
- mounting the package onto the circuit substrate;
- and
- heating the package under the elevated temperature and bonding the package to the circuit substrate under the elevated temperature, wherein the package heated under the elevated temperature is warped with a second warpage level, and the first warpage level is substantially in conformity with the second warpage level.
A manufacturing method, comprising:
- providing a fixture;
- disposing at least one spacer on the fixture;
- disposing a circuit substrate on the at least one spacer, over the fixture and covering the at least one spacer, wherein the circuit substrate has a mounting surface and mounting portions formed on the mounting surface, and the mounting surface includes a curved surface;
- mounting a package onto the mounting surface of the circuit substrate, wherein the package has a lower surface and connectors formed on the lower surface of the package;
- and
- performing a reflow process and bonding the connectors of the package to the mounting portions of the circuit substrate.
Dependencies are inferred from the claim text.