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US 2020/0006283 A1Published application
Methods for improved die bonding
AssigneeSkyworks Solutions, Inc.
InventorsJosé Manuel FLORES, Rogelio Eduardo ESTRADA, Daniel Orozco MARISCAL
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Abstract
Methods for improved die bonding. In some embodiments, a method includes applying hot air to a die. The method also includes placing the die on a substrate after applying the hot air to the die. The method further includes waiting a predefined bonding period in order to establish a bond between the die and the substrate.
Claims9
A method comprising:
- applying hot air to a die;
- placing the die on a substrate after applying the hot air to the die;
- and
- waiting a predefined bonding period in order to establish a bond between the die and the substrate.
1 more element
Dependencies are inferred from the claim text.