Semiconductor-device manufacturing method and manufacturing apparatus
AssigneesKabushiki Kaisha Shinkawa, Tohoku University
InventorsTomonori NAKAMURA, Takehito SHIMATSU, Miyuki UOMOTO
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Abstract
Provided is a bonding method for directly bonding an electrode part of a chip component to a bonding part provided on a substrate that is a bonding target, the method comprising: a step for placing the substrate on a stage inside a liquid vessel; a step for injecting liquid into the liquid vessel; and a step for bonding the electrode part of the chip component to the bonding part (electrode part) of the bonding target by superimposing the chip component held by a bonding head in the liquid stored in the liquid vessel over the bonding target and then applying pressure thereto.
Claims11
A semiconductor device manufacturing method for directly bonding an electrode part of a chip component to a bonding part provided on a bonding target, comprising:
- a placement step of placing the bonding target in a liquid vessel;
- a liquid injection step of injecting liquid into the liquid vessel;
- and
- a step of bonding the electrode part to the bonding part by stacking the chip component held by a bonding head on the bonding target in the liquid stored in the liquid vessel.
A semiconductor device manufacturing apparatus for directly bonding each electrode part of a chip component to a bonding part provided on a bonding target, comprising:
- a liquid vessel for storing liquid, with an inner space in which the bonding target is placed;
- and
- a bonding head for directly bonding the electrode part of the chip component to the bonding part of the bonding target by stacking the chip component and the bonding target together in the liquid stored in the liquid vessel.
Dependencies are inferred from the claim text.