Method of bonding terminal of semiconductor chip using solder bump and semiconductor package using the same
AssigneeJMJ Korea Co., Ltd.
InventorsYun Hwa CHOI, SoonSeong CHOI
Life of this patent
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Abstract
A method of bonding a terminal of a semiconductor chip using a solder bump includes preparing a semiconductor chip with an aluminum (Al) pad terminal formed thereon (S-1), forming a solder bump on the Al pad terminal through a primary solder (S-2), attaching the solder bump and a metal structure to each other via a secondary solder with a higher melting point than a melting point of the primary solder (S-3), performing heat treatment in an attachment state (S-4), and mixing the primary solder and the secondary solder that are melted during the heat treatment and converting a resulting mixture into a tertiary solder including one solder layer (S-4).
Claims10
A method of bonding a terminal of a semiconductor chip using a solder bump, the method comprising:
- preparing a semiconductor chip with an aluminum (Al) pad terminal formed thereon (S-1);
- forming the solder bump on the Al pad terminal through a primary solder (S-2);
- attaching the solder bump and a metal structure to each other via a secondary solder with a higher melting point than a melting point of the primary solder (S-3);
- performing heat treatment in a state in which the solder bump and the metal structure are attached (S-4);
- and
- mixing the primary solder and the secondary solder that are melted during the heat treatment and converting a resulting mixture into a tertiary solder including one solder layer (S-4).
Dependencies are inferred from the claim text.