Molded Semiconductor Package

A molded semiconductor package, comprising:

• a mold compound having a first main surface, a second main surface opposite the main surface, and an edge extending between the first and the second main surfaces;
• a semiconductor die embedded in the mold compound;
• and
• a plurality of metal pads embedded in the mold compound and electrically connected to the semiconductor die,
• wherein the metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound,
• wherein the metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound,
• wherein the faces of the metal pads uncovered by the mold compound are plated with a layer of nickel-phosphorus or nickel-boron alloy and a layer of gold.

A molded semiconductor package, comprising:

• a mold compound having a first main surface, a second main surface opposite the main surface, and an edge extending between the first and the second main surfaces;
• a semiconductor die embedded in the mold compound;
• and
• a plurality of metal pads embedded in the mold compound and electrically connected to the semiconductor die,
• wherein the metal pads have a bottom face which is uncovered by the mold compound at the second main surface of the mold compound,
• wherein the metal pads disposed around a periphery of the molded package have a side face which is uncovered by the mold compound at the edge of the mold compound,
• wherein the faces of the metal pads uncovered by the mold compound are plated,
• wherein the plated faces of the metal pads are covered with a protective layer.