Semiconductor device
AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuya KOBAYASHI, Atsushi KUROKAWA, Hiroaki TOKUYA, Isao OBU, Yuichi SAITO
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Abstract
A target element to be protected and a protrusion are arranged on a substrate. An insulating film arranged on the substrate covers the target element and at least a side surface of the protrusion. An electrode pad for external connection is arranged on the insulating film. The electrode pad at least partially overlaps the target element and the protrusion as seen in plan view. A maximum distance between the upper surface of the protrusion and the electrode pad in the height direction is shorter than a maximum distance between the upper surface of the target element and the electrode pad in the height direction.
Claims20
A semiconductor device comprising:
- a substrate;
- a target element to be protected arranged on the substrate;
- a protrusion arranged on the substrate;
- an insulating film arranged on the substrate and covering the target element and at least a side surface of the protrusion;
- and
- an electrode pad for external connection arranged on the insulating film, the electrode pad at least partially overlapping the target element and the protrusion as seen in plan view,
- wherein a maximum distance between an upper surface of the protrusion and the electrode pad in a height direction is shorter than a maximum distance between an upper surface of the target element and the electrode pad in the height direction.
A semiconductor device comprising:
- a substrate;
- an interconnection line arranged on the substrate;
- a protrusion arranged on the substrate;
- an insulating film arranged on the substrate, the insulating film covering the interconnection line and at least a side surface of the protrusion;
- and
- an electrode pad for external connection arranged on the insulating film, the electrode pad at least partially overlapping the interconnection line and the protrusion as seen in plan view,
- wherein a maximum distance between an upper surface of the protrusion and the electrode pad in a height direction is shorter than a maximum distance between an upper surface of the interconnection line and the electrode pad in the height direction.
Dependencies are inferred from the claim text.