Method of Forming Contact Holes in a Fan Out Package

A method comprising:

• depositing an encapsulant completely covering an active surface of a die and surrounding sidewalls of the die, the die disposed on a carrier, the active surface comprising an electrical pad;
• depositing a first dielectric layer over the encapsulant, the first dielectric layer having a first thickness from an upper surface of the first dielectric layer to a lower surface of the first dielectric layer;
• exposing the first thickness of the first dielectric layer to a light pattern, the light pattern corresponding to portions of the first dielectric layer which are to be removed in a subsequent developing process;
• developing the first dielectric layer to form a first opening through the first dielectric layer, the first opening exposing the electrical pad;
• and
• depositing a first conductive pattern over the first dielectric layer, the first conductive pattern electrically coupled to the electrical pad.

A method comprising:

• laterally encapsulating a die with an encapsulant, the encapsulant extending over a top surface of the die;
• forming a first opening in the encapsulant, the first opening exposing a contact pad of the die;
• depositing a first dielectric layer over the encapsulant and in the first opening;
• photo-patterning the first dielectric layer without using a separate photoresist mask, to form a second opening through the first dielectric layer to the contact pad;
• and
• depositing a first conductive pattern over the first dielectric layer and in the first opening and in the second opening, the first conductive pattern electrically coupled to the contact pad.