Device containing and method of providing carbon covered copper layer

A method for protecting a copper layer from, the method comprising:

• spinning on a first dielectric on a substrate comprising at least one of a semiconductor or mold compound;
• patterning the first dielectric to provide an opening in the first dielectric;
• plating a copper layer in the opening in the first dielectric;
• plating a redistribution layer on the copper layer;
• spinning on and patterning the solder resist layer to provide an opening in the solder resist layer to the redistribution layer;
• and
• attaching a solder ball in the opening in the solder resist layer, the solder ball in physical contact with the redistribution layer and in conductive contact with the copper layer,
• wherein a non-conductive carbon layer that provides a diffusion barrier to moisture for the copper layer is deposited on the substrate, and
• the non-conductive carbon layer is formed from carbon rather than a carbon compound and.

A printed circuit board (PCB) comprising:

• a substrate comprising at least one of a semiconductor or mold compound;
• a first dielectric disposed on substrate;
• a copper layer plated in an opening in the first dielectric;
• a redistribution layer plated on the copper layer;
• a solder resist layer disposed above the copper layer;
• a solder ball disposed in an opening in the solder resist layer, the solder ball in conductive contact with the copper layer and in physical contact with the redistribution layer;
• and
• a non-conductive carbon layer disposed on and in contact with one of the redistribution layer or the solder resist layer, the carbon layer configured to act as a diffusion barrier to moisture for the copper layer, the carbon layer being substantially thinner than the copper layer, the carbon layer is further disposed on the solder ball.