Systems and methods using an rf circuit on isolating material
AssigneeInfineon Techologies AG
InventorsCarsten Ahrens, Anton Steltenpohl, Edward Fuergut, Anneliese Mueller
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Abstract
A device is disclosed that includes a wafer/chip, a first layer, a first device, an isolation mold and a second device. The first layer is formed over the chip and has non-isolating characteristics. The first device is formed over the first layer. In one example, it is formed only over the first layer. The isolation mold is formed over the chip. The isolation mold has isolating characteristics. The second device is formed substantially over the isolation mold.
Claims22
A fabricating system to enhance radio frequency (RF) signals comprising:
- a process tool configured to perform fabrication processes on a semiconductor device;
- and
- a control unit configured control the process tool and to identify target areas of the device having high frequency components, remove underlying substrate material of the target areas and form a plurality of isolation molds only within the target areas.
A method for fabricating a device that enhance radio frequency (RF) signal integrity, the method comprising:
- determining one or more high frequency components from a plurality of components for a device;
- identifying one or more target areas that include the one or more high frequency components;
- removing at least coupling regions of the device within the one or more target areas;
- and
- forming one or more isolation molds within the one or more target areas.
A fabricating system comprising:
- a process tool configured to perform fabrication processes on a semiconductor device;
- and
- a control unit configured control the process tool and to identify target areas of the device having high frequency components, remove underlying substrate material of the target areas and form a plurality of isolation molds within the target areas.
A method for fabricating a device, the method comprising:
- providing a semiconductor device having a chip and a plurality of components formed thereon;
- identifying one or more high frequency components of the plurality of components that handle high frequency signals;
- identifying one or more target areas that include the one or more high frequency components;
- removing at least coupling regions of the wafer within the one or more target areas;
- and
- forming one or more isolation molds within the one or more target areas.
Dependencies are inferred from the claim text.