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US 2020/0006261 A1Published application
Inductor and transmission line with air gap
AssigneeIntel Corporation
InventorKevin LIN
Life of this patent
Estimating the term…
Abstract
An integrated circuit structure comprises one or more sets of first and second conductive lines along a same direction in an interlayer dielectric (ILD), the first and second conductive lines having a width greater than 2 μm. An air gap is in the ILD between the first and second conductive lines, the air gap extending across the ILD to sidewalls of the first and second conductive lines.
Claims25
An integrated circuit structure, comprising:
- one or more sets of first and second conductive lines along a same direction in an interlayer dielectric (ILD), the first and second conductive lines having a width greater than 2 μm;
- and
- an air gap in the ILD between the first and second conductive lines, the air gap extending across the ILD to sidewalls of the first and second conductive lines.
A method of fabricating a conductive structure, comprising:
- forming one or more sets of first and second conductive lines along a same direction in an interlayer dielectric (ILD), the first and second conductive lines having a width greater than 2 μm;
- and
- forming an air gap in the ILD between the first and second conductive lines, the air gap extending across the ILD to sidewalls of the first and second conductive lines.
A method of fabricating a conductive structure, comprising:
- forming conductive lines in or on an ILD, and forming a mask with openings defining locations for air gaps between adjacent conductive lines;
- etching the ILD under openings in the mask and removing the mask to form the air gaps in the ILD;
- depositing a sacrificial material into the air gaps and recessing the sacrificial material in the air gaps;
- conformally depositing a spacer material over the ILD, the conductive lines, and the sacrificial material;
- etching the spacer material to form one or more spacers in top corners of the air gaps and along sidewalls of adjacent ones of the conductive lines to decrease a width of open-ends of the air gaps;
- removing the sacrificial material from the air gaps;
- and
- forming a top dielectric layer over a top surface of the conductive structure to seal the air gaps.
5 more elements
Dependencies are inferred from the claim text.