Package with cathodic protection for corrosion mitigation

An apparatus comprising:

• a substrate to couple with one or more integrated circuit die(s);
• an integrated circuit die coupled to the substrate;
• a metal component coupled to the substrate, wherein the metal component lacks a sealing coating;
• and
• a sacrificial metal conductively coupled with the metal component, wherein the sacrificial metal comprises a more anodic metal than the metal component.

An apparatus comprising:

• one or more integrated circuit die(s);
• a metal component, wherein the metal component lacks a sealing coating;
• and
• a substrate, wherein the substrate comprises:
• a dielectric material;
• a plurality of conductive interconnects;
• one or more coupling site(s) for the one or more integrated circuit die(s);
• a sacrificial metal, wherein the sacrificial metal comprises a more anodic metal than the metal component;
• and
• a conductive trace to conductively couple the sacrificial metal with the metal component.

A system comprising:

• a display subsystem;
• a wireless communication interface;
• and
• an integrated circuit package, the integrated circuit package comprising:
• one or more integrated circuit die(s);
• a metal chassis to house one or more components;
• a magnet coupled with the metal chassis, wherein the magnet lacks a sealing coating;
• a sacrificial metal conductively coupled with the magnet, wherein the sacrificial metal comprises a more anodic metal than the magnet;
• and
• a substrate coupled with the metal chassis, wherein the substrate comprises:
• a dielectric material;
• a plurality of conductive interconnects;
• one or more coupling site(s) for the one or more integrated circuit die(s).

A method comprising:

• receiving a substrate to couple with one or more integrated circuit die(s);
• coupling an integrated circuit die with the substrate;
• coupling a metal component with the substrate, wherein the metal component lacks a sealing coating;
• and
• conductively coupling a sacrificial metal with the metal component, wherein the sacrificial metal comprises a more anodic metal than the metal component.