Semiconductor module

Abstract

A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface, the first surface including a first mounting area and a second mounting area; a plurality of circuit parts that includes a first circuit part and a second circuit part, the first circuit part being mounted on the first mounting area, the second circuit part being mounted on the second mounting area; an electrode layer that is disposed on the second surface and includes a plurality of electrode portions to be electrically connected to the plurality of circuit parts; and a sealing layer that includes a first sealing resin portion and a second sealing resin portion and seals the plurality of circuit parts, the first sealing resin portion covering the first mounting area, the second sealing resin portion being formed of a resin material softer than the first sealing resin portion and covering the second mounting area.

Dependencies are inferred from the claim text.