Dummy Dies for Reducing Warpage in Packages

A method comprising:

• placing a plurality of logic dies over a carrier;
• placing a plurality of Input-output (IO) dies over the carrier;
• placing a plurality of dummy dies over the carrier, wherein the plurality of dummy dies are distributed surrounding a region in which the plurality of logic dies and the plurality of IO dies are located;
• encapsulating the plurality of logic dies, the plurality of IO dies, and the plurality of dummy dies in an encapsulant;
• forming redistribution lines over and electrically coupling to the plurality of logic dies and the plurality of TO dies to form a reconstructed wafer, and the reconstructed wafer comprises the plurality of logic dies, the plurality of TO dies, the plurality of dummy dies, the encapsulant, and the redistribution lines;
• and
• de-bonding the reconstructed wafer from the carrier.

A package comprising:

• a reconstructed wafer comprising:
• a plurality of dummy dies;
• a plurality of functional dies in a center region of the package, wherein the plurality of dummy dies are allocated aligning a ring encircling the plurality of functional dies;
• an encapsulant encapsulating the plurality of dummy dies and the plurality of functional dies therein;
• and
• a plurality of Redistribution Lines (RDLs) over the plurality of functional dies, wherein the plurality of RDLs interconnect all functional dies in the package into an integrated system.