Back to results
US 2020/0006248 A1Published application
Electric Magnetic Shielding Structure in Packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen
Life of this patent
Estimating the term…
Abstract
A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.
Claims20
A method comprising:
- encapsulating a device die in an encapsulating material;
- and
- forming a metal shield to enclose the device die therein, wherein the forming the metal shield comprises:
- forming a first portion over the encapsulating material;
- forming a second portion under the encapsulating material;
- and
- forming a plurality of through-vias penetrating through the encapsulating material, wherein the plurality of through-vias electrically connects the first portion to the second portion of the metal shield, and wherein the device die and the metal shield are in a package.
4 more elements
A method comprising:
- applying a patterned photo resist over a carrier;
- plating a first plurality of conductive posts in the patterned photo resist;
- removing the patterned photo resist;
- encapsulating the first plurality of conductive posts and a device die in an encapsulating material;
- planarizing the first plurality of conductive posts, the device die, and the encapsulating material;
- forming a first plurality of conductive features;
- and
- forming a second plurality of conductive features, wherein the first plurality of conductive features and the second plurality of conductive features are on opposite sides of the encapsulating material, and the forming the second plurality of conductive features comprises:
- forming a conductive ring electrically coupling to the first plurality of conductive posts;
- and
- simultaneously forming a plurality of redistribution lines electrically decoupled from the conductive ring, wherein the plurality of redistribution lines is encircled by the conductive ring, with the device die, the first plurality of conductive features, and the second plurality of conductive features being in a package.
8 more elements
A method comprising:
- forming plurality of conductive posts;
- encapsulating the plurality of conductive posts and a device die in an encapsulating material;
- forming a metal ring over the encapsulating material, wherein the metal ring is electrically connected to the plurality of conductive posts;
- and
- forming a solder region electrically connecting to the metal ring and the plurality of conductive posts.
2 more elements
Dependencies are inferred from the claim text.