Stiffener shield for device integration

A method, comprising:

• providing a stiffener formed from an electrically conductive material;
• positioning a plurality of dies in respective recesses in the stiffener, such that the electrically conductive material in the stiffener at least partially electrically shields the dies from one another;
• and
• attaching the stiffener to a substrate, such that the dies electrically connect to the substrate via electrical connections that extend through the stiffener.

A chip package, comprising:

• a stiffener having a first side and a second side opposite the first side,
• the stiffener including a plurality of recesses on the first side,
• each recess extending over a respective recess area on the first side,
• each recess area including a respective plurality of electrical connections that extend through the stiffener to the second side of the stiffener,
• each recess defining a respective recess volume that extends into the first side of the stiffener,
• the stiffener being formed from an electrically conductive material that at least partially electrically shields the recess volumes from one another.