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US 2020/0006246 A1Published application
Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same
AssigneeIntel Corporation
InventorsJackson Chung Peng Kong, Bok Eng Cheah, Howard L. Heck, Seok Ling Lim, Jenny Shio Yin Ong
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Abstract
A stiffener includes an integrated cable-header recess that couples a semiconductor package substrate flexible cable. The flexible cable connects to a device on a board without using interconnections that are arrayed through the board. A semiconductive die is coupled to the semiconductor package substrate and flexible cable through the cable-header recess.
Claims22
A semiconductor package frame stiffener, comprising:
- a frame stiffener body including a top surface and a die-side ledge that is opposite the top surface, further including a die-side interconnect surface that is opposite the top surface, and further including a land-side interconnect surface that is parallel planar with the die-side interconnect surface;
- a through hole that communicates from the top surface to the die-side ledge, and from the top surface to the die-side interconnect surface:
- an integrated cable-header recess that communicates to the top surface, wherein the integrated cable-header recess is adjacent to the die-side interconnect surface and adjacent to the land-side interconnect surface;
- and
- a through-frame-stiffener interconnect (TFSI) that communicates from the land-side interconnect surface, through the frame stiffener and into the integrated cable-header recess.
2 more elements
A method of assembling a frame stiffener, comprising:
- forming a through hole in a blank;
- forming a die-side ledge in the blank, wherein the die-side ledge is opposite a top surface;
- forming an integrated cable-header recess adjacent the through hole, wherein the integrated cable-header recess is defined by a die-side interconnect surface and a land-side interconnect surface, and wherein the integrated cable-header recess communicates to the top surface;
- forming a through-frame-stiffener interconnect (TFSI) in the integrated cable-header recess to communicate to the land-side surface.
1 more element
A computing system, comprising:
- a semi conductive die disposed on a semiconductor package substrate;
- a frame stiffener body including a top surface and a die-side ledge that is opposite the top surface, further including a die-side interconnect surface that is opposite the top surface, and further including a land-side interconnect surface that is parallel planar with the die-side interconnect surface;
- wherein the semiconductor package substrate contacts the die-side ledge;
- a through hole that communicates from the top surface to the die-side ledge, and from the top surface to the die-side interconnect surface;
- an integrated cable-header recess that communicates to the top surface, wherein the integrated cable-header recess is adjacent to the die-side interconnect surface and adjacent to the land-side interconnect surface;
- wherein the semiconductor package substrate is coupled to the integrated cable-header recess through a folded redistribution layer that contacts the die-side interconnect surface;
- a through-frame-stiffener interconnect (TFSI) that communicates from the land-side interconnect surface, through the frame stiffener and into the integrated cable-header recess the die side;
- and
- a board at which the land side is mounted by at least one electrical bump, and wherein the board includes a dielectric outer shell.
6 more elements
Dependencies are inferred from the claim text.