Method of providing partial electrical shielding

A method for providing coil shielding for an electronic device, the method comprising:

• forming contact pad on a base;
• depositing and patterning a first dielectric on the base, the first dielectric patterned with a smaller via and a larger via;
• depositing a first seed layer on the smaller via and larger via, the first seed layer contacting a first contact pad under the smaller via;
• depositing and patterning a first plating resist layer after depositing the first seed layer, the first plating resist layer patterned to have openings above the smaller via and to fill the larger via to create shielding;
• plating a first copper layer in the openings of the first plating resist layer;
• removing the first plating resist layer after plating the first copper layer and removing portions of the first seed layer exposed after removal of the first plating resist layer;
• depositing and patterning a second dielectric after removal of the first seed layer, the second dielectric patterned to provide a dielectric via over the first copper layer;
• depositing a second seed layer on the dielectric via, the second seed layer contacting the first copper layer;
• depositing and patterning a second plating resist after depositing the second seed layer, the second plating resist patterned to have openings above the second seed layer in electrical communication with the first copper layer and to have a coil pattern above the shielding;
• plating a second copper layer after patterning the second plating resist to create contacts to the first contact pad and to create a coil above the shielding;
• removing the second plating resist layer after plating the second copper layer and removing portions of the second seed layer exposed after removal of the second plating resist layer;
• and
• depositing and patterning a solder resist layer after removal of the second seed layer, the solder resist layer covering the coil and having openings to contact the second copper layer in electrical communication with the first contact pad.

A method for providing coil shielding for an electronic device, the method comprising:

• depositing and patterning multiple dielectric layers on at least one of a semiconductor substrate or insulating mold compound, the dielectric layers patterned to provide conductive contact with a contact pad on the at least one of the semiconductor substrate or mold compound, shielding in a via of a lowermost of the dielectric layers comprising multiple layers that comprise an insulating material on a conductive seed layer;
• fabricating a conductive coil over the shielding;
• and
• depositing and patterning an insulating solder mask that covers and insulates the conductive coil, the conductive coil fabricated one of in a via of a dielectric layer immediately below the solder mask or above the dielectric layer immediately below the solder mask.