Microelectronic assemblies having interposers
AssigneeIntel Corporation
InventorsAleksandar Aleksov, Johanna M. Swan
Life of this patent
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Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a high bandwidth interconnect, a first interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the first interposer is electrically coupled to the high bandwidth interconnect, and a second interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the second interposer is electrically coupled to the high bandwidth interconnect, and wherein the first interposer is electrically coupled to the second interposer via the high bandwidth interconnect.
Claims25
A microelectronic assembly, comprising:
- a package substrate having a high bandwidth interconnect;
- a first interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the first interposer is electrically coupled to the high bandwidth interconnect;
- and
- a second interposer having high bandwidth circuitry coupled to the package substrate, wherein the high bandwidth circuitry of the second interposer is electrically coupled to the high bandwidth interconnect, and wherein the first interposer is electrically coupled to the second interposer via the high bandwidth interconnect.
A microelectronic assembly, comprising:
- a package substrate including a radio frequency (RF) waveguide;
- a first interposer having a first surface including RF circuitry and an opposing second surface, wherein the RF circuitry of the first interposer is electrically coupled to the RF waveguide;
- and
- a second interposer having a first surface including RF circuitry and an opposing second surface, wherein the RF circuitry of the second interposer is electrically coupled to the RF waveguide, and wherein the first interposer is electrically coupled to the second interposer via the RF waveguide.
A computing device, comprising:
- a microelectronic assembly, comprising:
- a package substrate including a radio frequency (RF) waveguide;
- a first interposer coupled to the package substrate;
- an RF die having a first surface and an opposing second surface, wherein the first surface of the RF die is electrically coupled to the RF waveguide and the second surface of the RF die is electrically coupled to the first interposer;
- and
- a second interposer having a first surface including RF circuitry and an opposing second surface, wherein RF circuitry of the second interposer is electrically coupled to the RF waveguide, and wherein the first interposer is electrically coupled to the second interposer via the RF waveguide.
A method of manufacturing a microelectronic assembly, comprising:
- electrically coupling a plurality of dies on a first interposer, wherein the first interposer includes high bandwidth circuitry;
- electrically coupling a plurality of dies on a second interposer, wherein the second interposer includes high bandwidth circuitry;
- coupling the first interposer and the second interposer to a package substrate having a high bandwidth interconnect;
- electrically coupling the high bandwidth circuitry in the first interposer and the high bandwidth interconnect in the package substrate;
- and
- electrically coupling the high bandwidth circuitry in the second interposer and the high bandwidth interconnect in the package substrate.
Dependencies are inferred from the claim text.