Hybrid fan-out architecture with emib and glass core for heterogeneous die integration applications
AssigneeIntel Corporation
InventorsSrinivas PIETAMBARAM, Rahul MANEPALLI, Gang DUAN
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Abstract
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, a microelectronic device package may include a redistribution layer (RDL) and an interposer over the RDL. In an embodiment, a glass core may be formed over the RDL and surround the interposer. In an embodiment, the microelectronic device package may further comprise a plurality of dies over the interposer. In an embodiment, the plurality of dies are communicatively coupled with the interposer.
Claims25
A microelectronic device package, comprising:
- a redistribution layer (RDL);
- an interposer over the RDL;
- a glass core over the RDL and surrounding the interposer;
- and
- a plurality of dies over the interposer, wherein the plurality of dies are communicatively coupled with the interposer.
A method for forming a microelectronic device package, comprising:
- attaching a glass core to a glass carrier, wherein the glass carrier comprises a glass substrate, a release film, and a seed layer;
- forming a conductive via through the glass core;
- disposing an interposer over the glass carrier within the glass core;
- disposing a dielectric material over the interposer;
- forming a redistribution layer (RDL) over the dielectric layer and the glass core;
- detaching the glass carrier;
- and
- mounting a plurality of dies over the interposer, wherein the plurality of dies are communicatively coupled to the interposer.
A computing system, comprising:
- redistribution layer (RDL);
- a glass core over the RDL;
- a plurality of first dies within a perimeter of the glass core, wherein the plurality of first dies are communicatively coupled by a bridge, and wherein the bridge is embedded in the RDL;
- a plurality of second dies over the first dies, wherein the plurality of first dies are communicatively coupled to the first dies;
- and
- a dielectric layer over the first dies and the second dies.
Dependencies are inferred from the claim text.