Semiconductor device, chip-shaped semiconductor element, electronic device provided with semiconductor device, and method of manufacturing semiconductor device

A chip-shaped semiconductor element flip-chip mounted on a wiring board to which an underfilling material is applied,

• wherein a plurality of solder bumps and a plurality of protrusions including an insulating material are provided on a surface of the chip-shaped semiconductor element on a side facing the wiring board.

An electronic device comprising

• a semiconductor device including a wiring board and a chip-shaped semiconductor element flip-chip mounted on the wiring board,
• wherein a plurality of solder bumps and a plurality of protrusions including an insulating material are provided on a surface of the chip-shaped semiconductor element on a side facing the wiring board, and
• the chip-shaped semiconductor element is arranged so as to face the wiring board via an underfilling material in a state in which the underfilling material having a characteristic that viscosity decreases with an increase in temperature is applied to the wiring board and then subjected to reflow treatment to be flip-chip mounted on the wiring board.

A method of manufacturing a semiconductor device, comprising

• arranging a chip-shaped semiconductor element provided with a plurality of solder bumps and a plurality of protrusions including an insulating material on a surface on a side facing a wiring board so as to face the wiring board via an underfilling material in a state in which the underfilling material having a characteristic that viscosity decreases with an increase in temperature is applied to the wiring board, and then applying reflow treatment to flip-chip mount the chip-shaped semiconductor element on the wiring board.