Interposer with flexible portion

A method, comprising:

• providing an interposer, the interposer including a first portion configured to electrically connect to a top side of a motherboard, the interposer including a flexible portion adjacent to the first portion and configured to wrap around an edge of the motherboard, the interposer including a peripheral portion adjacent to the flexible portion and configured to electrically connect to a bottom side of the motherboard, the interposer including a motherboard-facing side and a chip-facing side opposite the motherboard-facing side, the motherboard-facing side configured to electrically connect to the top side of the motherboard and electrically connect to the bottom side of the motherboard, the first portion of the interposer defining a cavity that extends from the motherboard-facing side of the interposer to chip-facing side of the interposer;
• electrically connecting a package substrate of a chip package to the chip-facing side of the first portion of the interposer, the package substrate coupled to least one electrical component that extends into the cavity;
• electrically connecting the top side of the motherboard to the motherboard-facing side of the first portion of the interposer;
• wrapping the flexible portion of the interposer around an edge of the motherboard;
• and
• electrically connecting the bottom side of the motherboard to the motherboard-facing side of the peripheral portion of the interposer.

A system, comprising:

• a motherboard;
• and
• an interposer including a rigid first portion electrically connected to a top side of the motherboard, the interposer including a flexible portion adjacent to the first portion and wrapped around an edge of the motherboard, the interposer including a peripheral portion adjacent to the flexible portion and electrically connected to a bottom side of the motherboard, the interposer including a motherboard-facing side and a chip-facing side opposite the motherboard-facing side, the motherboard-facing side electrically connected to the top side of the motherboard and electrically connected to the bottom side of the motherboard, the first portion of the interposer defining a cavity extending from the motherboard-facing side of the interposer to chip-facing side of the interposer;
• a chip package electrically connected to the chip-facing side of the first portion of the interposer, the chip package including a package substrate electrically connected to the interposer, the package substrate coupled to least one electrical component that extends into the cavity.