Core-shell particles for magnetic packaging
AssigneeIntel Corporation
InventorsBrandon MARIN, Whitney BRYKS
Life of this patent
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Abstract
A package substrate may include a build-up layer. The build-up layer may include a dielectric material and one or more microspheres. The one or more microspheres may include a magnetic core that includes a first material that is a first oxidation-resistant material. Further, the one or more microspheres may include a shell to encapsulate the core, and the shell may include a second material that is a second oxidation-resistant material. The package substrate may further include a metal layer coupled with the build-up layer.
Claims20
A package substrate, comprising:
- a build-up layer comprising:
- a dielectric material;
- and
- one or more microspheres, wherein the one or more microspheres include a magnetic core that includes a first material that is a first oxidation-resistant material,
- wherein the one or more microspheres include a shell to encapsulate the core, and
- wherein the shell includes a second material that is a second oxidation-resistant material;
- and
- a metal layer coupled with the build-up layer.
A build-up layer, comprising:
- a dielectric material;
- and
- one or more microspheres, wherein the one or more microspheres include a magnetic core that includes a first material that is a first oxidation-resistant material, wherein the one or more microspheres include a shell to encapsulate the core, and wherein the shell includes a second material that is a second oxidation-resistant material.
A semiconductor package, comprising:
- a package substrate, comprising:
- a build-up layer comprising:
- a dielectric material;
- and
- one or more microspheres, wherein the one or more microspheres include a magnetic core that includes a first material that is a first oxidation-resistant material, wherein the one or more microspheres include a shell to encapsulate the core, and wherein the shell includes a second material that is a second oxidation-resistant material;
- and
- a metal layer coupled with the build-up layer;
- and
- a die coupled with the package substrate.
Dependencies are inferred from the claim text.