Semiconductor cooling arrangement

A semiconductor cooling arrangement, comprising:

• one or more semiconductor assemblies, each assembly comprising a heatsink and one or more semiconductor power devices thermally coupled to the heatsink;
• a housing for housing the one or more assemblies in a chamber within the housing, the housing comprising inlet and outlet ports in fluid communication with the chamber respectively for receiving and outputting a cooling fluid, the chamber being flooded with a cooling fluid to cool the assemblies;
• wherein the heatsink comprises heat exchanging elements in the form of a plurality of holes in the heatsink extending through the heatsink from a front face of the heatsink, onto which the one or more semiconductor power devices are coupled, to a rear face of the heatsink opposing the front face, such that the cooling fluid flows through the holes to extract heat from the heatsink.