Heat conduction structure or semiconductor apparatus
AssigneesToyota Jidosha Kabushiki Kaisha, National University Corporation Nagoya University
InventorsTakeshi BESSHO, Masataka DEGUCHI, Nagahiro SAITO, Kazuo HASHIMI
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Abstract
The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease. The self-assembled monolayer is formed on at least one surface of the first member and the second member. The heat dissipation grease is disposed between the first member and the second member. The heat dissipation grease is in contact with the self-assembled monolayer.
Claims9
A heat conduction structure where heat is conducted from a first member to a second member, comprising:
- at least one self-assembled monolayer formed on at least one surface of the first member and the second member;
- and
- a heat dissipation grease disposed between the first member and the second member, the heat dissipation grease being in contact with the at least one self-assembled monolayer.
Dependencies are inferred from the claim text.