Microelectronic assemblies including a thermal interface material

A microelectronic assembly, comprising:

• a package substrate having a first surface and an opposing second surface;
• a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate;
• a cooling apparatus thermally coupled to the second surface of the die;
• and
• a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than 245 degrees Celsius.

A computing device, comprising:

• a microelectronic assembly, comprising:
• a package substrate having a first surface and an opposing second surface;
• a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate;
• a cooling apparatus thermally coupled to the second surface of the die;
• and
• a thermal interface material (TIM) between the cooling apparatus and the second surface of the die, wherein the TIM includes an indium alloy having a liquidus temperature between 245 degrees Celsius and 400 degrees Celsius and a solidus temperature between 125 degrees Celsius and 160 degrees Celsius.