Integrated fan-out packages with embedded heat dissipation structure

A method comprising:

• forming a first redistribution structure on a carrier, the first redistribution structure having dummy metal patterns;
• attaching a backside of a die to the first redistribution structure;
• forming a molding material over the first redistribution structure around the die;
• forming a second redistribution structure over the die and the molding material;
• removing the carrier after forming the second redistribution structure;
• after removing the carrier, forming first openings in the first redistribution structure, the first openings extending through the first redistribution structure and exposing the dummy metal patterns;
• and
• forming a metal paste in the first openings, the metal paste contacting the dummy metal patterns of the first redistribution structure.

A method comprising:

• forming a first redistribution structure over a carrier;
• forming a conductive pillar over the first redistribution structure;
• attaching a first side of a die to the first redistribution structure using an adhesive layer, the die having a dummy metal layer extending along its first side, the dummy metal layer contacting the adhesive layer;
• embedding the die and the conductive pillar in a molding material formed over the first redistribution structure;
• forming a second redistribution structure over the molding material, the die, and the conductive pillar;
• performing a carrier de-bonding process to remove the carrier;
• after the carrier is removed, forming first openings that extend through the first redistribution structure and the adhesive layer, the first openings exposing the dummy metal layer;
• and
• filling the first openings with a thermally conductive material.