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US 2020/0006187 A1Published application
Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing Thereof
OwnerRalf Otremba, Irmgard Escher-Poeppel +3inventors
InventorsRalf Otremba, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss, Thorsten Scharf
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Abstract
A heat dissipation device includes a first part having a first material and a surface portion, and a second part on the surface portion. The second part has a second material and a porosity.
Claims29
A heat dissipation device, comprising:
- a first part comprising a first material and having a surface portion;
- and
- a second part directly coupled to the surface portion and comprising a second material,
- wherein the second part has a porosity,
- wherein the first part further comprises a barrier layer and/or an adhesion layer and/or an adhesion promotion layer.
2 more elements
A packaging system, comprising:
- a package comprising an electronic chip, the package having a package body encapsulating the electronic chip, the package body having an exposed heat transfer surface made of metal;
- and
- a heat dissipation device thermally coupled to the heat transfer surface, the heat dissipation device comprising a first part comprising a first material and having a surface portion, and a second part directly coupled to the surface portion and comprising a second material, the second part having a porosity, the first part further comprising a barrier layer and/or an adhesion layer and/or an adhesion promotion layer.
A method of manufacturing a heat dissipation device comprising a first part and a second part, the method comprising:
- providing the first part, the first part comprising a first material and having a surface portion, the first part further comprising a barrier layer and/or an adhesion layer and/or an adhesion promotion layer;
- and
- depositing particles of a second material on the surface portion to form the second part.
An electronic apparatus, comprising:
- a support;
- and
- a packaging system mounted to the support, the packaging system comprising:
- a package comprising an electronic chip, the package having a package body encapsulating the electronic chip, the package body having an exposed heat transfer surface made of metal;
- and
- a heat dissipation device thermally coupled to the heat transfer surface, the heat dissipation device comprising a first part comprising a first material and having a surface portion, and a second part directly coupled to the surface portion and comprising a second material, the second part having a porosity, the first part further comprising a barrier layer and/or an adhesion layer and/or an adhesion promotion layer.
3 more elements
A method of manufacturing an electronic apparatus, the method comprising:
- mounting a package to a support, the package comprising an electronic chip;
- thermally coupling a heat dissipation device to the package, the heat dissipation device comprising:
- a first part comprising a first material and having a surface portion;
- and
- a second part directly coupled to the surface portion and comprising a second material,
- wherein the second part has a porosity,
- wherein the first part further comprises a barrier layer and/or an adhesion layer and/or an adhesion promotion layer.
4 more elements
A method of manufacturing a packaging system, the method comprising:
- providing a package comprising an electronic chip;
- and
- mounting a heat dissipation device to the package, the heat dissipation device comprising:
- a first part comprising a first material and having a surface portion;
- and
- a second part directly coupled to the surface portion and comprising a second material,
- wherein the second part has a porosity,
- wherein the first part further comprises a barrier layer and/or an adhesion layer and/or an adhesion promotion layer.
5 more elements
Dependencies are inferred from the claim text.