Integrated circuit die with in-chip heat sink
AssigneeXilinx, Inc.
InventorsHong-Tsz Pan, Jonathan Chang, Nui Chong, Henley Liu, Gamal Refai-Ahmed, Suresh Ramalingam
Life of this patent
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Abstract
A method and apparatus are provided that includes an integrated circuit die having an in-chip heat sink, along with an electronic device and a chip package having the same, and methods for fabricating the same. In one example, an integrated circuit die has an in-chip heat sink that separates a high heat generating integrated circuit from another integrated circuit disposed within the die. The in-chip heat sink provides a highly conductive heat transfer path from interior portions of the die to at least one exposed die surface.
Claims20
An integrated circuit die comprising:
- a die body having an upper surface and a lower surface, the bottom surfacing having a plurality of bond pad for establishing electrical connection with circuitry within the die body;
- a first circuit disposed in the die body and electrically coupled to at least one of the bond pads, the first circuit configured to operate at a first temperature;
- a second circuit disposed in the die body and electrically coupled to at least one of the bond pads, the second circuit configured to operate at a second temperature that is less than the first temperature;
- and
- an in-chip heat sink having a ring-shape and an orientation extending between the upper surface and the lower surface, the in-chip heat sink separating the first circuit from the second circuit.
An integrated circuit chip package comprising:
- a package substrate having a top side and a bottom side;
- and
- a first integrated circuit (IC) die coupled to the top side of the package substrate by first solder connections, the first IC die comprising:
- a die body having an upper surface and a lower surface, the bottom surfacing having a plurality of bond pad for establishing electrical connection with circuitry within the die body;
- a first circuit disposed in the die body and electrically coupled to at least one of the bond pads, the first circuit configured to operate at a first temperature;
- a second circuit disposed in the die body and electrically coupled to at least one of the bond pads, the second circuit configured to operate at a second temperature that is less than the first temperature;
- and
- an in-chip heat sink having a ring-shape and an orientation extending between the upper surface and the lower surface, the in-chip heat sink separating the first circuit from the second circuit.
An integrated circuit chip package comprising:
- a package substrate having a top side and a bottom side;
- a first integrated circuit die having a first in-chip heat sink;
- and
- a second integrated circuit die disposed on the top side of the package substrate and having a second in-chip heat sink that is coupled to the first in-chip heat sink through one or more solder connections.
Dependencies are inferred from the claim text.