Multi-layer solution based deposition of dielectrics for advanced substrate architectures

A method of forming an electronic package, comprising:

• forming a plurality of conductive features over a substrate;
• disposing a first dielectric layer over the plurality of conductive features, wherein the first dielectric layer comprises a plurality of local maxima and local depressions, wherein the local maxima are positioned over the conductive features, and wherein the local depressions are located between conductive features;
• and
• disposing a second dielectric layer over the first dielectric layer, wherein the second dielectric layer fills the local depressions.

An electronics package, comprising:

• a package substrate, wherein the package substrate comprises:
• a plurality of bilayer build-up layers, wherein each bilayer build-up layer comprises a first dielectric layer and a second dielectric layer that is different than the first dielectric layer;
• and
• a die electrically and mechanically coupled to the package substrate.

An electronics package, comprising:

• a mold layer;
• a die embedded in the mold layer, wherein a surface of the mold layer comprises a depression;
• and
• a dielectric layer over the mold layer, wherein the dielectric layer is a spun-on dielectric layer that fills the depression.