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US 2020/0006176 A1Published application
Chip package structure with molding layer and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Hao TSAI, Techi WONG, Meng-Wei CHOU, Meng-Liang LIN, Po-Yao CHUANG, Shin-Puu JENG
Life of this patent
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Abstract
A method for forming a chip package structure is provided. The method includes disposing a chip over a redistribution structure. The method includes forming a molding layer over the redistribution structure adjacent to the chip. The method includes partially removing the molding layer to form a trench in the molding layer, and the trench is spaced apart from the chip.
Claims20
A method for forming a chip package structure, comprising:
- disposing a chip over a redistribution structure;
- forming a molding layer over the redistribution structure and adjacent to the chip;
- and
- partially removing the molding layer to form a trench in the molding layer, wherein the trench is spaced apart from the chip.
1 more element
A method for forming a chip package structure, comprising:
- disposing a first chip and a second chip over a redistribution structure, wherein the redistribution structure comprises an insulating layer and a wiring layer, the wiring layer is in the insulating layer and electrically connected to the first chip and the second chip;
- forming a molding layer over the redistribution structure, wherein the molding layer surrounds the first chip and the second chip;
- and
- forming a first trench in the molding layer and between the first chip and the second chip, wherein the first trench is spaced apart from the first chip and the second chip.
1 more element
A chip package structure, comprising:
- a redistribution structure;
- a first chip over the redistribution structure;
- a molding layer over the redistribution structure and surrounding the first chip;
- and
- a heat dissipation layer over the first chip and the molding layer, wherein a first portion of the heat dissipation layer extends into the molding layer, and a first thermal conductivity coefficient of the heat dissipation layer is greater than a second thermal conductivity coefficient of the molding layer.
2 more elements
Dependencies are inferred from the claim text.