Module

A module comprising:

• a wiring substrate;
• a third component mounted on a principal surface of the wiring substrate;
• a sealing resin layer having a contact surface in contact with the wiring substrate and an opposed surface opposed to the contact surface, the sealing resin layer sealing the third component;
• at least two depressions at the opposed surface of the sealing resin layer;
• and
• a radiating member set in each the depression, each of the radiating members including at least one radiator element,
• wherein the third component has a first inner-component region and a second inner-component region as seen from a direction perpendicular to the principal surface of the wiring substrate, an amount of heat generated from the second inner-component region is larger than an amount of heat generated from the first inner-component region,
• the radiating members have a region overlapping the first inner-component region and a region overlapping the second inner-component region as seen from the direction perpendicular to the principal surface of the wiring substrate,
• the depressions do not reach the third component, and
• a distance from a bottom of the depression in the region overlapping the second inner-component region in the radiating member to the third component is shorter than a distance from a bottom of the depression in the region overlapping the first inner-component region in the radiating member to the third component.

A module comprising:

• a wiring substrate;
• a fourth component and a fifth component mounted on a principal surface of the wiring substrate;
• a sealing resin layer having a contact surface in contact with the wiring substrate and an opposed surface opposed to the contact surface, the sealing resin layer sealing the fourth component and the fifth component;
• at least two depressions at the opposed surface of the sealing resin layer;
• and
• at least two radiating members, each set in each of the depressions, each of the radiating members including at least one radiator element,
• wherein an amount of heat generated from the fifth component is smaller than an amount of heat generated from the fourth component,
• the depressions do not reach the fourth component, and
• the radiating members have a region overlapping the fourth component and do not have a region overlapping the fifth component as seen from a direction perpendicular to the principal surface of the wiring substrate.

A module comprising:

• a wiring substrate;
• a sixth component mounted on a principal surface of the wiring substrate;
• a sealing resin layer having a contact surface in contact with the wiring substrate and an opposed surface opposed to the contact surface and sealing the sixth component;
• at least one depression at the opposed surface of the sealing resin layer;
• and
• a radiating member set in the depression,
• wherein the sixth component has a first inner-component region and a second inner-component region whose amount of heat generated is larger than that of the first inner-component region as seen from a direction perpendicular to the principal surface of the wiring substrate,
• the depression does not reach the sixth component, and
• the radiating member has a region overlapping the second inner-component region and does not have a region overlapping the first inner-component region as seen from a direction perpendicular to the principal surface of the wiring substrate.