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US 2020/0006171 A1Published application
Metallization Patterns in Semiconductor Packages and Methods of Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee
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Abstract
An embodiment method includes encapsulating a semiconductor die in an encapsulant, planarizing the encapsulant, and depositing a polymer material on the encapsulant. The method further includes planarizing the polymer material and forming a metallization pattern on the polymer material. The metallization pattern electrically connects a die connector of the semiconductor die to a conductive feature disposed outside of the semiconductor die.
Claims20
A package comprising:
- an integrated circuit die comprising a die connector;
- an encapsulant disposed around the integrated circuit die;
- a polymer material over at least a portion of the encapsulant;
- an impurity disposed at a top surface of the polymer material, a material of the impurity being different than the polymer material;
- and
- a conductive line over the polymer material, the conductive line electrically connecting the die connector to a conductive feature, and a portion of the encapsulant is disposed between the die connector and the conductive feature.
3 more elements
A package comprising:
- a semiconductor die;
- a molding material encapsulating the semiconductor die, wherein the molding material comprises a hollow-core filler material;
- a polymer material, wherein a filler material circumferentially surrounds a bottom portion of the polymer material, wherein the filler material is a same material as the hollow-core filler material;
- and
- a conductive line electrically connected to the semiconductor die, the conductive line further overlying the molding material and the polymer material.
2 more elements
A package comprising:
- a first die;
- a second die;
- a molding compound between the first die and the second die, the molding compound comprising a filler material;
- a polymer material having a top surface substantially planar with the molding compound;
- a polymer layer over the polymer material, wherein an impurity is disposed at an interface between the polymer material and the polymer layer, wherein the impurity comprises silicon or aluminum;
- and
- a conductive line over the polymer layer, the conductive line electrically connects the first die to the second die.
4 more elements
Dependencies are inferred from the claim text.