Micro-electronic package with barrier structure

A method comprising:

• providing a micro-electronic component;
• coupling a face of the micro-electronic component to a surface of a substrate;
• dispensing a barrier structure on the surface of the substrate along an outside perimeter of an edge of the micro-electronic component;
• and
• dispensing an encapsulant material between the barrier structure and the edge of the micro-electronic component to substantially fill a gap between the face of the micro-electronic component and the substrate to substantially surround interconnect structures between the micro-electronic component and the substrate, wherein the barrier structure is to exceed a height of the encapsulant material in at least a portion of an open region of the surface of the substrate to confine the encapsulant material to an area substantially surrounded by the barrier structure.

A system, comprising:

• an integrated circuit (IC) die;
• a micro-electronic component coupled to the IC die and having a first face and a second face, wherein the first face is coupled to the IC die and is opposite the second face, wherein the second face includes interconnect structures;
• a substrate having electrical contacts formed on a surface of the substrate, wherein the substrate is coupled to the micro-electronic component via the interconnect structures of the micro-electronic component;
• a fill material that fills a gap between the micro-electronic component and the substrate and substantially surrounds the interconnect structures;
• and
• a barrier structure located on the surface of the substrate and along a perimeter of the micro-electronic component or the IC die, wherein an inside surface of the barrier structure is to confine the fill material to an area substantially proximate to the barrier structure, and wherein a height of the barrier structure exceeds a height of the fill material in at least a portion of an open region of the substrate.