Microelectronic assemblies
AssigneeIntel Corporation
InventorsDigvijay Raorane, Mathew Manusharow
Life of this patent
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Abstract
Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a package substrate; a stiffener having a surface, wherein the stiffener includes a cavity and a conductive pathway between the cavity and the surface of the stiffener, and wherein the stiffener is coupled to the package substrate such that the surface of the stiffener is between the cavity and the package substrate; and an electrical component, wherein the electrical component is embedded in the cavity and is electrically coupled to the package substrate via the conductive pathway.
Claims25
A microelectronic assembly, comprising:
- a package substrate;
- a stiffener having a surface, wherein the stiffener includes a cavity and a conductive pathway between the cavity and the surface of the stiffener, and wherein the stiffener is coupled to the package substrate such that the surface of the stiffener is between the cavity and the package substrate;
- and
- an electrical component, wherein the electrical component is embedded in the cavity and is electrically coupled to the package substrate via the conductive pathway.
A microelectronic stiffener apparatus, comprising:
- a stiffener having a surface, wherein the stiffener includes a cavity and a conductive pathway between the cavity and the surface of the stiffener;
- and
- an electrical component, wherein the electrical component is embedded in the cavity and is electrically coupled to the conductive pathway.
A computing device, comprising:
- a circuit board;
- and
- an integrated circuit (IC) package, wherein the IC package comprises:
- a package substrate;
- and
- a stiffener having an embedded electrical component and a conductive pathway between the embedded electrical component and a surface of the stiffener, wherein the embedded electrical component is electrically coupled to the package substrate via the conductive pathway.
A method for fabricating a microelectronic assembly, the method comprising:
- forming a conductive pathway through a first portion of a stiffener;
- forming a cavity in a second portion of the stiffener;
- placing an electrical component having a conductive contact on the first portion of the stiffener with the conductive contact facing the first portion of the stiffener;
- forming an electrical connection between the electrical component and the first portion of the stiffener;
- and
- attaching the first portion of the stiffener to the second portion of the stiffener, wherein the cavity opening in the second portion of the stiffener faces the first portion and the electrical component is within the cavity.
Dependencies are inferred from the claim text.