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US 2020/0006164 A1Published application
Semiconductor Device Package and Method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Hui-Wen Liu, Ching-Pin Yuan
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Abstract
In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.
Claims20
A method comprising:
- stacking a plurality of first dies to form a device stack;
- revealing testing pads of a topmost die of the device stack;
- testing the device stack using the testing pads of the topmost die;
- and
- after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.
2 more elements
A method comprising:
- bonding a first die to a first carrier substrate;
- stacking a plurality of second dies and a plurality of dummy devices on the first die to form a device stack;
- bonding a second carrier substrate to the plurality of second dies and the plurality of dummy devices of the device stack;
- removing the first carrier substrate from the first die;
- forming conductive bumps on the first die;
- testing the first die and the device stack using the conductive bumps of the first die;
- and
- singulating the second carrier substrate and portions of the dummy devices to form a first device package.
5 more elements
A device comprising:
- a first die having a first function;
- a device stack on the first die, the device stack comprising a plurality of layers, each of the layers comprising:
- a second die having a second function;
- a dummy device adjacent the second die, the dummy device comprising alignment marks;
- and
- an encapsulant disposed between the dummy device and the second die;
- and
- a first substrate on the device stack, the first substrate comprising alignment marks.
5 more elements
Dependencies are inferred from the claim text.