Integrated fan-out packages and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee
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Abstract
A method of forming a semiconductor device includes attaching a metal foil to a carrier, the metal foil being pre-made prior to attaching the metal foil; forming a conductive pillar on a first side of the metal foil distal the carrier; attaching a semiconductor die to the first side of the metal foil; forming a molding material around the semiconductor die and the conductive pillar; and forming a redistribution structure over the molding material.
Claims20
A method of forming a semiconductor device, the method comprising:
- forming a conductive pillar over a first side of a carrier;
- attaching a backside of a die to the first side of the carrier;
- forming a molding material over the first side of the carrier around the die and around the conductive pillar;
- forming a redistribution structure over the die, the conductive pillar, and the molding material;
- removing the carrier, wherein after removing the carrier, a first end of the conductive pillar distal to the redistribution structure is exposed;
- forming a heat sink on the backside of the die;
- and
- bonding a semiconductor package to the first end of the conductive pillar, the heat sink being between the semiconductor package and the die.
A method of forming a semiconductor device, the method comprising:
- forming conductive pillars on a carrier;
- attaching a backside of a die to the carrier adjacent to the conductive pillars using an adhesive layer;
- surrounding the die and the conductive pillars with a molding material;
- forming a redistribution structure at a front side of the die, the redistribution structure electrically coupled to the die and first ends of the conductive pillars;
- de-bonding the carrier;
- removing the adhesive layer to form a recess in the molding material;
- and
- forming a heat sink in the recess.
A method of forming a semiconductor device, the method comprising:
- attaching a die to a carrier using an adhesive layer;
- forming a conductive pillar over the carrier adjacent to the die;
- surrounding the conductive pillar and the die with a molding material, wherein die connectors of the die and a first end surface of the conductive pillar are exposed at a first side of the molding material facing away from the carrier;
- forming a redistribution structure at the first side of the molding material, the redistribution structure electrically coupled to the die and the conductive pillar;
- removing the carrier;
- removing the adhesive layer to form a recess in the molding material;
- forming a heat sink in the recess by depositing a thermally conductive material in the recess on the die;
- and
- bonding a semiconductor package to a second end surface of the conductive pillar opposing the first end surface.
Dependencies are inferred from the claim text.