Method and Plater Arrangement for Failure-Free Copper Filling of a Hole in a Component Carrier

Abstract

A plater arrangement for filling a hole formed in a component carrier with copper is disclosed. The plater arrangement includes an electroless plater section for forming a layer of an electrically conductive material, which layer covers at least part of a surface of a wall of a component carrier and where the wall delimits the hole in the component carrier and an electro-plater section for covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper by an electro-plating process, wherein at least partially covering the layer and at least partially filling the hole is done by flash-plating. The electro-plater section having a bath for plating with copper.

Dependencies are inferred from the claim text.