Package-on-package structure and method of manufacturing package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Hui Cheng, Chin-Fu Kao, Chih-Yuan Chien, Szu-Wei Lu
Life of this patent
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Abstract
A package-on-package (PoP) structure includes a first package and a second package stacked on the first package. The first package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The die includes an amorphous layer located on the rear surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is on the active surface of the die and is electrically connected to the conductive structures and the die.
Claims21
1-9. (canceled)
A method of manufacturing a package, comprising:
- providing a carrier having a de-bonding layer formed thereon;
- forming a conductive structure over the de-bonding layer, wherein the conductive structure comprises a seed layer attached to the de-bonding layer;
- attaching a die on the de-bonding layer through an adhesive layer, wherein the die comprises an amorphous layer attached to the adhesive layer;
- removing the carrier;
- removing the de-bonding layer and the adhesive layer to expose the amorphous layer;
- and
- removing a portion of the seed layer after removing the de-bonding layer and the adhesive layer.
A method of manufacturing a package, comprising:
- providing a carrier having a de-bonding layer formed thereon;
- forming a conductive structure over the de-bonding layer;
- attaching a die on the de-bonding layer through an adhesive layer, wherein the die comprises a semiconductor substrate and an amorphous layer covering the semiconductor substrate, wherein the amorphous layer is attached to the adhesive layer;
- forming a redistribution structure over the die and the conductive structure;
- removing the carrier;
- performing a dry etching process to remove the de-bonding layer;
- and
- performing a wet etching process to remove the adhesive layer and leaving the amorphous layer to cover the semiconductor substrate of the die after performing the wet etching process.
A method of manufacturing a package, comprising:
- providing a de-bonding layer;
- forming a conductive structure over the de-bonding layer, wherein the conductive structure comprises a seed layer attached to the de-bonding layer;
- attaching a die on the de-bonding layer through an adhesive layer, wherein the die comprises an amorphous layer attached to the adhesive layer;
- removing the de-bonding layer and the adhesive layer to expose the amorphous layer;
- removing a portion of the seed layer after removing the de-bonding layer and the adhesive layer;
- and
- removing a portion of the encapsulant.
Dependencies are inferred from the claim text.