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US 2020/0006113 A1Published application
Methods of Sealing Openings, and Methods of Forming Integrated Assemblies
AssigneeMicron Technology, Inc.
InventorGuangjun Yang
Life of this patent
Estimating the term…
Abstract
Some embodiments include a method of forming an integrated assembly. A construction is formed to include a structure having an exposed surface, and to include an opening proximate the structure. An aperture extends into the opening. A first material is deposited to form a mass along the exposed surface of the structure. Particles are sputtered from the mass and across the aperture. The particles agglomerate to form a sealant material which traps a void within the opening.
Claims20
1-32. (canceled)
A method of forming an integrated assembly, comprising:
- providing a construction having an opening between a pair of spaced structures;
- and
- covering an upper portion of the opening with a sealant material and leaving a lower portion of the opening empty.
Dependencies are inferred from the claim text.