Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same

A transfer module for implementation with one or more processing modules for moving a workpiece into and out of the one or more processing modules for the fabrication of electronic devices thereon, the transfer module comprising:

• a transfer chamber having an internal space for the movement of the workpiece, the transfer chamber comprising one or more transfer ports disposed around a perimeter of the transfer chamber;
• a transfer mechanism positioned inside the internal space of the transfer chamber and configured to move the workpiece along a horizontal plane within the internal space and selectively into and out of the one or more processing modules being opposite a corresponding transfer port;
• and
• an optical inspection system coupled to the transfer chamber, the optical inspection system comprising a sensor aperture disposed opposite of the horizontal plane and within the perimeter of the transfer chamber.

A manufacturing platform for the fabrication of electronic devices, comprising:

• a plurality of processing modules hosted on a common manufacturing platform for processing a workpiece through a plurality of processes in a process sequence.
• a transfer module coupled to the common manufacturing platform and with the plurality of process modules for moving the workpiece into and out of the processing modules to effect the process sequence;
• the transfer module comprising:
• a transfer chamber having an internal space for the movement of the workpiece,
• a transfer mechanism positioned inside the internal space of the transfer chamber and configured to move the workpiece through the internal space and selectively into and out of the processing modules;
• a pass-through chamber having an internal space for the movement of the workpiece, the pass-through chamber positioned between the transfer chamber and another chamber, the another chamber including a processing module or another transfer chamber;
• a first measurement region located within the internal space of the transfer chamber, the measurement region accessible by the transfer mechanism for positioning the workpiece in the measurement region at least one of before or after the workpiece is processed in a processing module;
• a second measurement region located within the internal space of the pass-through chamber, the measurement region accessible by the transfer mechanism for positioning the workpiece in the measurement region;
• a first inspection system configured to engage the workpiece that is positioned in the first measurement region, the inspection system operable for measuring data associated with an attribute on the workpiece;
• and
• a second inspection system configured to engage the workpiece that is positioned in the second measurement region, the inspection system operable for measuring data associated with an attribute on the workpiece.