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US 2020/0006052 A1Published application
Integrate Rinse Module in Hybrid Bonding Platform
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsXin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
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Abstract
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
Claims20
A method comprising:
- using an apparatus to form a package component, the apparatus comprising a surface treatment station and an integrated cleaning station, and the method comprising:
- performing a plasma treatment on the package component in the surface treatment station;
- removing oxides on surface metal pads of the package component in the integrated cleaning station;
- and
- cleaning the package component using de-ionized water in the integrated cleaning station.
2 more elements
A method comprising:
- providing an integrated cleaning station comprising:
- a chamber;
- a retractable wafer support in the chamber, wherein the retractable wafer support is configured to rotate at different levels;
- a first container;
- and
- a second container in the first container, wherein a first top edge of the first container is higher than a second top edge of the second container, and the retractable wafer support has a lower portion in the second container;
- placing a package component on the retractable wafer support;
- dispensing a first chemical onto the package component;
- collecting the first chemical using the first container;
- dispensing a second chemical onto the package component;
- and
- collecting the second chemical using the second container.
9 more elements
A method comprising:
- rotating a package component on a retractable wafer support, with the retractable wafer support being in a chamber;
- dispensing a first chemical onto the package component;
- collecting the first chemical using a first container, wherein the first container is inside the chamber;
- dispensing a second chemical onto the package component;
- and
- collecting the second chemical using a second container, wherein the second container is inside the first container.
3 more elements
Dependencies are inferred from the claim text.