Multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• two or more of electronic component main bodies each including:
• a multilayer body including a plurality of dielectric layers that are laminated and a plurality of inner electrode layers that are laminated, and including a first principal surface and a second principal surface opposing each other in a lamination direction, a first side surface and a second side surface opposing each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and a first end surface and a second end surface opposing each other in a lengthwise direction orthogonal or substantially orthogonal to both of the lamination direction and the width direction;
• a first outer electrode disposed at least on the first side surface of the multilayer body, and a second outer electrode spaced apart from the first outer electrode and disposed at least on the first side surface;
• a first metal terminal connected to the first outer electrode of one of the electronic component main bodies;
• a second metal terminal connected to the second outer electrode of another one of the electronic component main bodies;
• and
• a third metal terminal bridging across and connected to the second outer electrode of the one of the electronic component main bodies and the first outer electrode of the another one of the electronic component main bodies;
• wherein
• the two or more of the electronic component main bodies are spaced apart from each other, and arranged such that the first end surfaces, the second end surfaces, or the first end surface and the second end surface of the respective electronic component main bodies oppose each other;
• the plurality of inner electrode layers of each of the two or more of the electronic component main bodies include a first inner electrode layer and a second inner electrode layer;
• the first inner electrode layer includes a first opposing section opposing the second inner electrode layer, and a first extended section extended to at least part of the first side surface;
• the second inner electrode layer includes a second opposing section opposing the first inner electrode layer, and a second extended section that does not overlap with the first extended section of the first inner electrode layer and that extends to at least a portion of the first side surface;
• each of the two or more of the electronic component main bodies is disposed such that the first side surface or the second side surface opposes a mounting surface of a mounting substrate on which the multilayer ceramic electronic component is to be mounted, and the first inner electrode layer and the second inner electrode layer of each of the two or more of the electronic component main bodies are perpendicular or substantially perpendicular to the mounting surface;
• and
• a portion of the first side surface of each of the two or more of the electronic component main bodies, the first outer electrode and the second outer electrode of each of the two or more of the electronic component main bodies, and a portion of the first metal terminal, a portion of the second metal terminal and the third metal terminal are covered with an exterior material.