Process for making a fingerprint sensor package module and the fingerprint sensor package module made thereby

A process for making a fingerprint sensor package module, comprising the steps of:

• a) providing a substrate having an upper surface, which includes a mounting region and a surrounding region surrounding the mounting region;
• b) disposing a fingerprint sensor chip over the mounting region of the substrate with a bottom surface and a top surface of the fingerprint sensor chip respectively proximate to and distal from the upper surface of the substrate, the top surface including a sensing region and an encapsulated region surrounding the sensing region;
• c) forming a masking layer on the sensing region of the fingerprint sensor chip;
• d) electrically connecting the substrate to the fingerprint sensor chip;
• e) molding an encapsulation structure which overlies the encapsulated region of the fingerprint sensor chip and the surrounding region of the substrate and which confines the masking layer;
• and
• f) removing the masking layer to expose the sensing region of the fingerprint sensor chip.