Electronic device fabric integration
AssigneeIntel Corporation
InventorsNadine L. Dabby, Sasha N. Oster, Aleksandar Aleksov, Braxton Lathrop, Racquel L. Fygenson
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AssigneeIntel Corporation
InventorsNadine L. Dabby, Sasha N. Oster, Aleksandar Aleksov, Braxton Lathrop, Racquel L. Fygenson
Estimating the term…
Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.
A stretchable and flexible electronic method comprising:
At least one machine-readable storage medium, comprising a plurality of instructions that, responsive to being executed with processor circuitry of a computer-controlled device, cause the computer-controlled device to:
Dependencies are inferred from the claim text.