Mask and method for fabricating the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHUANG-MING WU, JIUN-HAO LIN, JIA-GUEI JOU, CHI-TA LU, CHI-MING TSAI
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHUANG-MING WU, JIUN-HAO LIN, JIA-GUEI JOU, CHI-TA LU, CHI-MING TSAI
Estimating the term…
Present disclosure provide a method for fabricating a mask, including obtaining a target pattern to be imaged onto a substrate, providing a first scattering bar and a second scattering bar adjacent to consecutive edges of the target pattern, identifying a first length of the first scattering bar and a second length of the second scattering bar, connecting the first scattering bar and the second scattering bar when any of the first length and the second length is smaller than a predetermined value, identifying a separation between the first scattering bar and the second scattering bar subsequent to identifying the first length and the second length, disposing the first scattering bar and the second scattering bar in a first fashion when the separation is equal to zero, and disposing the first scattering bar and the second scattering bar in a second fashion when the separation is greater than zero.
A method for fabricating a mask, comprising:
A mask, comprising:
A method for fabricating a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.