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US 2020/0002502 A1Published application
Resin composition, and molding material and multilayer structure comprising same
AssigneeMitsubishi Chemical Corporation
InventorsNobuyuki YAMAMOTO, Akira ONO, Fumimasa MAKI
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Abstract
The present invention provides a resin composition having a high level of processability, which is a resin composition including a saponified ethylene-vinyl ester-based copolymer (A), a layered inorganic compound (B), and a carbonic acid salt (C) (provided that the carbonic acid salt (C) excludes the layered inorganic compound (B)).
Claims5
A resin composition comprising:
- a saponified ethylene-vinyl ester-based copolymer (A), a layered inorganic compound (B), and a carbonic acid salt (C), provided that the carbonic acid salt (C) excludes the layered inorganic compound (B).
Dependencies are inferred from the claim text.