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US 2020/0002162 A1Published application
Semiconductor device packages and methods of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChi Sheng TSENG, Lu-Ming LAI, Yu-Hsuan TSAI, Yin-Hao CHEN, Hsin Lin WU, San-Kuei YU
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Abstract
A semiconductor device package includes a semiconductor device, a non-semiconductor substrate over the semiconductor device, and a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
Claims20
A semiconductor device package, comprising:
- a semiconductor device;
- a non-semiconductor substrate over the semiconductor device;
- and
- a first connection element extending from the semiconductor device to the non-semiconductor substrate and electrically connecting the semiconductor device to the non-semiconductor substrate.
1 more element
A method for manufacturing a semiconductor device package, the method comprising;
- providing a semiconductor wafer having a plurality of device regions, each of the device regions comprising a micro-electrical-mechanical component;
- forming a patterned insulation layer over the semiconductor wafer, surrounding the micro-electrical-mechanical component in each of the device regions;
- and
- bonding a patterned substrate to the semiconductor wafer and spaced by the patterned insulation layer.
1 more element
Dependencies are inferred from the claim text.