MEMS Package and Method of Manufacturing the Same
AssigneeSAE Magnetics (H.K.) Ltd.
InventorsMasashi Shiraishi, Toyotaka Kobayashi, Hironobu Hayashi
Life of this patent
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Abstract
A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a plurality of bonding bumps adhered to both of an opposing surface, of the element substrate and the package substrate. The MEMS package has unevenly arranged structure which all the plurality of bonding bumps are unevenly arranged in a part of the opposing surface.
Claims14
A MEMS package comprising:
- a MEMS chip, and a package substrate which the MEMS chip is adhered;
- wherein the MEMS chip comprises an element substrate which a movable element is formed,
- wherein the MEMS package comprises a plurality of bonding bumps adhered to both an opposing surface, of the element substrate, which opposes the package substrate and the package substrate,
- wherein the MEMS package comprises an unevenly arranged structure which all the plurality of bonding bumps are unevenly arranged in a part of the opposing surface.
A method of manufacturing a MEMS package, using a MEMS chip and a package substrate which the MEMS chip is adhered comprising:
- a bump forming step of forming a plurality of solder bumps on an opposing surface, of the MEMS chip, opposing to the package substrate;
- and
- a MEMS chip mounting step of mounting a MEMS chip with bump, which the plurality of solder bumps are formed by the bump forming step, on the package substrate;
- wherein the bump forming step is performed so that at least two solder bumps of the plurality of solder bumps become unevenly arranged bumps which are unevenly arranged in a part of the opposing surface,
- wherein the MEMS chip mounting step is performed so that the unevenly arranged bumps are arranged in electrode pads formed in a package surface, of the package substrate, opposing to the MEMS chip, and at least one solder bump except for the unevenly arranged bumps is arranged in an insulated pad, formed in a package surface, which the surface is insulated.
Dependencies are inferred from the claim text.