Stressed decoupled micro-electro-mechanical system sensor

A micro-electro-mechanical system (MEMS) sensor, comprising:

• a first region comprising a MEMS structure;
• a second region;
• a stress decoupling structure that at least partially decouples the first region and the second region,
• wherein the stress decoupling structure includes a set of trenches;
• and
• a sealing element to prevent penetration of the set of trenches.

A method, comprising:

• forming a stress decoupling structure that at least partially decouples a first region of a semiconductor device and a second region of the semiconductor device,
• wherein the stress decoupling structure includes a set of trenches that are substantially perpendicular to a main surface of the semiconductor device;
• and
• applying a sealing element that at least partially seals openings associated with the stress decoupling structure.