Heat treatment susceptor and heat treatment apparatus

Abstract

A plurality of substrate support parts provided on a susceptor each have an outer circumferential surface such that a plane parallel to a holding surface of a holding plate is formed on a top portion of a spherical surface. Even if a semiconductor wafer irradiated with flash light abruptly warps such that its front surface becomes raised, a back surface of the semiconductor wafer can smoothly rub against the plurality of substrate support parts. This can prevent chipping and breakage of the substrate support parts, and can also prevent scratches on the back surface of the semiconductor wafer. The substrate support parts having the outer circumferential surface of the above-mentioned shape can be located in any directions on the holding plate, thereby facilitating manufacturing, inspection, and management of the susceptor relating to the substrate support parts.

Dependencies are inferred from the claim text.